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Proceedings Paper

Localization concept of re-decomposition area to fix hotspots for LELE process
Author(s): Yoko Yokoyama; Keishi Sakanushi; Yukihide Kohira; Atsushi Takahashi; Chikaaki Kodama; Satoshi Tanaka; Shigeki Nojima
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Paper Abstract

Litho-Etch-Litho-Etch (LELE) type double patterning technology (DPT) is known to have an advantage of layout flexibility. However, there are two problems when a hotspot, which is not fixable by tuning OPC, is detected. One is repeating a data preparation flow including decomposition, OPC, and verification by lithography simulation is quite time consuming. The other is a risk to introduce new hotspots at different locations. In this report, a new method to fix hotspots with layout modification of limited area will be presented. The proposed method can reduce not only turnaround time to fix a hotspot but also the number of iterations since it prevents generation of hotspots at new locations.

Paper Details

Date Published: 28 March 2014
PDF: 8 pages
Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530V (28 March 2014); doi: 10.1117/12.2046263
Show Author Affiliations
Yoko Yokoyama, Toshiba Corp. (Japan)
Keishi Sakanushi, Toshiba Corp. (Japan)
Yukihide Kohira, The Univ. of Aizu (Japan)
Atsushi Takahashi, Tokyo Institute of Technology (Japan)
Chikaaki Kodama, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
Shigeki Nojima, Toshiba Corp. (Japan)

Published in SPIE Proceedings Vol. 9053:
Design-Process-Technology Co-optimization for Manufacturability VIII
John L. Sturtevant; Luigi Capodieci, Editor(s)

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