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Proceedings Paper

Improved adhesion of novolac and epoxy based resists by cationic organic materials on critical substrates for high volume patterning applications
Author(s): Anja Voigt; Gisela Ahrens; Marina Heinrich; Andrew Thompson; Gabi Gruetzner
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Paper Abstract

Microlithography uses a variety of resists and polymer materials to create patterns and lithographic structures on several types of substrates. Excellent adhesion of the resists and polymers to the substrate is a prerequisite for successful patterning and pattern transfer. This paper presents the results of an investigation of the effects of an adhesion promoter, SurPass, on the lithographic process when used in combination with a variety of resists, and substrate materials. SurPass is a waterborne, non-hazardous, cationic organic surface active agent that promotes adhesion by modifying the substrate surface energy without deposition, chemical change or impact on electrical properties of the substrate material. The effectiveness of SurPass in combination with several novolac and epoxy resists on various substrate materials will be presented.

Paper Details

Date Published: 27 March 2014
PDF: 9 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511K (27 March 2014); doi: 10.1117/12.2046258
Show Author Affiliations
Anja Voigt, micro resist technology GmbH (Germany)
Gisela Ahrens, micro resist technology GmbH (Germany)
Marina Heinrich, micro resist technology GmbH (Germany)
Andrew Thompson, DisChem, Inc. (United States)
Gabi Gruetzner, micro resist technology GmbH (Germany)


Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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