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Proceedings Paper

Handling, clamping, and alignment evaluation for multi-beam technology on Matrix1.1 platform
Author(s): Ludovic Lattard; Jonathan Pradelles; Niels Vergeer; Erwin Slot; Laurent Pain; Erik de Jong; Gianpaolo Torriani; Charles Pieczulewski
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Paper Abstract

The MATRIX platform integrates new types of modules for handling and alignment capability and this represents two new and innovative aspects for multi-beam lithography. Results on performances in terms of robustness of the different modules in real manufacturing conditions, including the interface of the MATRIX platform with the SOKUDO DUO track will be reported. A new type of alignment solution was developed by MAPPER. This paper will show the first results on alignment sensor repeatability. Preliminary results on the overlay performance of the MATRIX platform will be presented and discussion will be engaged to position the MAPPER alignment concept with respect to the ITRS roadmap expectations.

Paper Details

Date Published: 2 April 2014
PDF: 7 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90502E (2 April 2014); doi: 10.1117/12.2046233
Show Author Affiliations
Ludovic Lattard, CEA-LETI (France)
Jonathan Pradelles, CEA-LETI (France)
Niels Vergeer, MAPPER Lithography (Netherlands)
Erwin Slot, MAPPER Lithography (Netherlands)
Laurent Pain, CEA-LETI (France)
Erik de Jong, MAPPER Lithography (Netherlands)
Gianpaolo Torriani, Dainippon Screen Deutschland GmbH (Germany)
Charles Pieczulewski, SOKUDO Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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