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Proceedings Paper

Improvement of inter-field CDU by using on-product focus control
Author(s): Kyeong Dong Park; Tony Park; Jong Hyun Hwang; Jin Phil Choi; Young Seog Kang
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Paper Abstract

This paper introduces to improve inter-field CDU with on-product focus control by diffraction based focus (DBF) method. For DBF target selection, a robust focus metrology for focus control was obtained, and the selected DBF target was integrated on each seven spot of a product reticle. For on-product focus control, previously on-product focus monitoring was performed, and the monitored lots showed a stable focus fingerprint. Based on the result, Z and Z/ Rx/Ry corrections per field on wafers were applied. Focus uniformity of controlled wafers was improved up to 29% in comparison with non-corrected ones. To demonstrate the improvement of inter-field CDU, Full CDs on wafers were measured by SEM. As a result, inter-field CDU for controlled wafers was improved by 16% (3σ) compared with noncontrolled wafers.

Paper Details

Date Published: 2 April 2014
PDF: 8 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90500R (2 April 2014); doi: 10.1117/12.2046224
Show Author Affiliations
Kyeong Dong Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Tony Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jong Hyun Hwang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jin Phil Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Young Seog Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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