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Proceedings Paper

Nanometrology on gratings with GISAXS: FEM reconstruction and fourier analysis
Author(s): Victor Soltwisch; Jan Wernecke; Anton Haase; Jürgen Probst; Max Schoengen; Michael Krumrey; Frank Scholze
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Paper Abstract

The aim of the semiconductor industry to decrease the feature size of integrated circuits poses a huge technological endeavor. Consequently, new challenges are arising for metrology on structures in the nanometer regime. Scatterometry is a fast method which provides non-contact non-destructive characterization of structures on photomasks or exposed wafers. However, the determination of important line structure parameters with subnanometer accuracy still needs further investigation. Grazing incidence small-angle X-ray scattering (GISAXS) is a scatterometry technique to measure both vertical and lateral structural features in the nanometer range with high sensitivity. We apply GISAXS to the investigation of structural parameters such as period length, sidewall angle, linewidth and height on silicon gratings. Our test structures with nominal widths of 35 nm to 100 nm and a pitch from 100 nm to 250 nm were fabricated by electron beam lithography. The diffraction patterns have been analyzed by power spectral density analysis which directly yields periodical modulations of the structured surface such as line width or groove width. We also apply a finite element method (FEM) to the diffraction peak intensity of the grating structure obtained with GISAXS for the geometric reconstruction of the line shape.

Paper Details

Date Published: 2 April 2014
PDF: 12 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905012 (2 April 2014); doi: 10.1117/12.2046212
Show Author Affiliations
Victor Soltwisch, Physikalisch-Technische Bundesanstalt (Germany)
Jan Wernecke, Physikalisch-Technische Bundesanstalt (Germany)
Anton Haase, Physikalisch-Technische Bundesanstalt (Germany)
Jürgen Probst, Helmholtz-Zentrum Berlin (Germany)
Max Schoengen, Helmholtz-Zentrum Berlin (Germany)
Michael Krumrey, Physikalisch-Technische Bundesanstalt (Germany)
Frank Scholze, Physikalisch-Technische Bundesanstalt (Germany)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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