Share Email Print

Proceedings Paper

New robust edge detection methodology for qualifying DSA characteristics by using CD SEM
Author(s): Satoru Yamaguchi; Kazuhiro Ueda; Takeshi Kato; Norio Hasegawa; Takashi Yamauchi; Shinichiro Kawakami; Makoto Muramatsu; Seiji Nagahara; Takahiro Kitano
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Grapho-epitaxy based hole shrink process of Directed Self-assembly (DSA) is one of the candidates for less than 30 nm hole pattern fabrication. The guide patterns of grapho-epitaxy are made by using ArF immersion scanner under the condition of near resolution limit to the 193-nm exposure. Hence, guide patterns have measurable level of edge roughness and edge placement errors. Those errors cause serious size errors and placement errors of DSA hole patterns. RED (Robust Edge Detection) is a new measurement function of CD-SEM for qualifying guide pattern shapes and DSA pattern shapes simultaneously. We also propose GBM (Grid Based Metrology) for the measurement of DSA hole's absolute placement error. In this paper, we applied the two methods for qualifying about 20 nm-node’s different polymer film thickness of DSA hole process. The DSA placement error from GBM result and relative DSA placement error obtained by RED are almost same as about 3nm (3sigma). This indicates both RED and GBM methods are correct to measure the DSA process error.

Paper Details

Date Published: 2 April 2014
PDF: 9 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905029 (2 April 2014); doi: 10.1117/12.2046136
Show Author Affiliations
Satoru Yamaguchi, Hitachi High-Technologies Corp. (Japan)
Kazuhiro Ueda, Hitachi High-Technologies Corp. (Japan)
Takeshi Kato, Hitachi High-Technologies Corp. (Japan)
Norio Hasegawa, Hitachi High-Technologies Corp. (Japan)
Takashi Yamauchi, Tokyo Electron Kyushu Ltd. (Japan)
Shinichiro Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
Makoto Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
Seiji Nagahara, Tokyo Electron Ltd. (Japan)
Takahiro Kitano, Tokyo Electron Kyushu Ltd. (Japan)

Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

© SPIE. Terms of Use
Back to Top