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Proceedings Paper

Evaluation of integration schemes for contact-hole grapho-epitaxy DSA: a study of substrate and template affinity control
Author(s): A. Romo-Negreira; T. R. Younkin; R. Gronheid; S. Demuynck; N. Vandenbroeck; T. Seo; D. J. Guerrero; D. Parnell; M. Muramatsu; S. Kawakami; T. Yamauchi; K. Nafus; M. H. Somervell
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Paper Abstract

An electrical test vehicle for fabricating direct self-assembly (DSA) sub-30 nm via interconnects has been fabricated employing a soft mask grapho-epitaxy contact-hole shrink. The generation of the resist pre-pattern was carried out using 193i lithography on three different stacks and the BCP assembly was evaluated with and without template affinity control on the resist pre-pattern. After DSA shrink, the holes were transferred in a 100 nm oxide for standard Tungsten metallization for electrical characterization.

Paper Details

Date Published: 28 March 2014
PDF: 11 pages
Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491L (28 March 2014); doi: 10.1117/12.2046119
Show Author Affiliations
A. Romo-Negreira, Tokyo Electron Europe Ltd. (Netherlands)
T. R. Younkin, Intel Corp. (United States)
R. Gronheid, IMEC (Belgium)
S. Demuynck, IMEC (Belgium)
N. Vandenbroeck, IMEC (Belgium)
T. Seo, Tokyo Ohka Kogyo Co., Ltd. (Japan)
D. J. Guerrero, Brewer Science, Inc. (Belgium)
D. Parnell, Tokyo Electron Europe Ltd. (Netherlands)
M. Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
S. Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
T. Yamauchi, Tokyo Electron Kyushu Ltd. (Japan)
K. Nafus, Tokyo Electron America, Inc. (United States)
M. H. Somervell, Tokyo Electron America, Inc. (United States)

Published in SPIE Proceedings Vol. 9049:
Alternative Lithographic Technologies VI
Douglas J. Resnick; Christopher Bencher, Editor(s)

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