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Proceedings Paper

Integrated production overlay field-by-field control for leading edge technology nodes
Author(s): Woong Jae Chung; John Tristan; Karsten Gutjahr; Lokesh Subramany; Chen Li; Yulei Sun; Mark Yelverton; Young Ki Kim; Jeong Soo Kim; Chin-Chou Kevin Huang; William Pierson; Ramkumar Karur-Shanmugam; Brent Riggs; Sven Jug; John C. Robinson; Lipkong Yap; Vidya Ramanathan
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Paper Abstract

As photolithography will continue with 193nm immersion multiple patterning technologies for the leading edge HVM process node, the production overlay requirement for critical layers in logic devices has almost reached the scanner hardware performance limit. To meet the extreme overlay requirements in HVM production environment, this study investigates a new integrated overlay control concept for leading edge technology nodes that combines the run-to-run (R2R) linear or high order control loop, the periodic field-by-field or correction per exposure (CPE) wafer process signature control loop, and the scanner baseline control loop into a single integrated overlay control path through the fab host APC system. The goal is to meet the fab requirements for overlay performance, lower the cost of ownership, and provide freedom of control methodology. In this paper, a detailed implementation of this concept will be discussed, along with some preliminary results.

Paper Details

Date Published: 2 April 2014
PDF: 10 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90501P (2 April 2014); doi: 10.1117/12.2046076
Show Author Affiliations
Woong Jae Chung, GLOBALFOUNDRIES Inc. (United States)
John Tristan, GLOBALFOUNDRIES Inc. (United States)
Karsten Gutjahr, GLOBALFOUNDRIES Inc. (United States)
Lokesh Subramany, GLOBALFOUNDRIES Inc. (United States)
Chen Li, GLOBALFOUNDRIES Inc. (United States)
Yulei Sun, GLOBALFOUNDRIES Inc. (United States)
Mark Yelverton, GLOBALFOUNDRIES Inc. (United States)
Young Ki Kim, GLOBALFOUNDRIES Inc. (United States)
Jeong Soo Kim, GLOBALFOUNDRIES Inc. (United States)
Chin-Chou Kevin Huang, KLA-Tencor Corp. (United States)
William Pierson, KLA-Tencor Corp. (United States)
Ramkumar Karur-Shanmugam, KLA-Tencor Corp. (United States)
Brent Riggs, KLA-Tencor Corp. (United States)
Sven Jug, KLA-Tencor Corp. (United States)
John C. Robinson, KLA-Tencor Corp. (United States)
Lipkong Yap, KLA-Tencor Corp. (United States)
Vidya Ramanathan, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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