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Proceedings Paper

High-volume manufacturing equipment and processing for directed self-assembly applications
Author(s): Mark Somervell; Takashi Yamauchi; Soichiro Okada; Tadatoshi Tomita; Takanori Nishi; Etsuo Iijima; Takeo Nakano; Takumi Ishiguro; Seiji Nagahara; Hiroyuki Iwaki; Makiko Dojun; Mariko Ozawa; Koichi Yatsuda; Toshikatsu Tobana; Ainhoa Romo Negreira; Doni Parnell; Shinchiro Kawakami; Makoto Muramatsu; Benjamen Rathsack; Kathleen Nafus; Jean-Luc Peyre; Takahiro Kitano
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Paper Abstract

Directed Self-Assembly (DSA) is one of the most promising technologies for scaling feature sizes to 16 nm and below. Both line/space and hole patterns can be created with various block copolymer morphologies, and these materials allow for molecular-level control of the feature shapes—exactly the characteristics that are required for creating high fidelity lithographic patterns. Over the past five years, the industry has been addressing the technical challenges of maturing this technology by addressing concerns such as pattern defectivity, materials specifications, design layout, and tool requirements. Though the learning curve has been steep, DSA has made significant progress toward implementation in high-volume manufacturing. Tokyo Electron has been focused on the best methods of achieving high-fidelity patterns using DSA processing. Unlike other technologies where optics and photons drive the formation of patterns, DSA relies on surface interactions and polymer thermodynamics to determine the final pattern shapes. These phenomena, in turn, are controlled by the processing that occurs on clean-tracks, etchers, and cleaning systems, and so a host of new technology has been developed to facilitate DSA. In this paper we will discuss the processes and hardware that are emerging as critical enablers for DSA implementation, and we will also demonstrate the kinds of high fidelity patterns typical of mainstream DSA integrations.

Paper Details

Date Published: 27 March 2014
PDF: 11 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90510N (27 March 2014); doi: 10.1117/12.2045975
Show Author Affiliations
Mark Somervell, Tokyo Electron America, Inc. (United States)
Takashi Yamauchi, Tokyo Electron Kyushu Ltd. (Japan)
Soichiro Okada, Tokyo Electron Kyushu Ltd. (Japan)
Tadatoshi Tomita, Tokyo Electron Kyushu Ltd. (Japan)
Takanori Nishi, Tokyo Electron Kyushu Ltd. (Japan)
Etsuo Iijima, Tokyo Electron Miyagi Ltd. (Japan)
Takeo Nakano, Tokyo Electron Ltd. (Japan)
Takumi Ishiguro, Tokyo Electron Ltd. (Japan)
Seiji Nagahara, Tokyo Electron Ltd. (Japan)
Hiroyuki Iwaki, Tokyo Electron Ltd. (Japan)
Makiko Dojun, Tokyo Electron Ltd. (Japan)
Mariko Ozawa, Tokyo Electron Ltd. (Japan)
Koichi Yatsuda, Tokyo Electron Ltd. (Japan)
Toshikatsu Tobana, Tokyo Electron Ltd. (Japan)
Ainhoa Romo Negreira, Tokyo Electron Ltd. (Belgium)
Doni Parnell, Tokyo Electron Europe Ltd. (Netherlands)
Shinchiro Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
Makoto Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
Benjamen Rathsack, Tokyo Electron America, Inc. (United States)
Kathleen Nafus, Tokyo Electron Ltd. (Belgium)
Jean-Luc Peyre, Tokyo Electron Europe Ltd. (France)
Takahiro Kitano, Tokyo Electron Kyushu Ltd. (Japan)


Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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