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Proceedings Paper

SEMATECH's cycles of learning test for EUV photoresist and its applications for process improvement
Author(s): Jun Sung Chun; Shih-Hui Jen; Karen Petrillo; Cecilia Montgomery; Dominic Ashworth; Mark Neisser; Takashi Saito; Lior Huli; David Hetzer
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Paper Abstract

With current progress in exposure source power, novel resist materials, and post processing techniques, EUV is getting closer to the production environment. As reported continuously, SEMATECH established cycles of learning program. The data generated from the program has been utilized to measure current state of the art of EUV photoresist for production or pilot line use. Thanks to SEMATECH core and associate members’ attention to the project, numerous EUV samples have been tested and they were based on the best performing EUV resists from associate members. This year we completed the evaluations for under-layers, lines and spaces, and contact holes. We also applied track based techniques to drive both low line edge roughness control and enlarge the process window with techniques such as FIRMTM and track based smoothing process. In this paper we will discuss about the results from cycles of learning test and show post-processing results of the three best line and space resists when combined with different FIRMTM materials.

Paper Details

Date Published: 17 April 2014
PDF: 15 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90481Z (17 April 2014); doi: 10.1117/12.2045905
Show Author Affiliations
Jun Sung Chun, SEMATECH Inc. (United States)
SUNY College of Nanoscale Science and Engineering (United States)
Shih-Hui Jen, SEMATECH Inc. (United States)
Karen Petrillo, SEMATECH Inc. (United States)
Cecilia Montgomery, SEMATECH Inc. (United States)
Dominic Ashworth, SEMATECH Inc. (United States)
Mark Neisser, SEMATECH Inc. (United States)
Takashi Saito, TEL Technology Ctr., America, LLC (United States)
Lior Huli, TEL Technology Ctr., America, LLC (United States)
David Hetzer, TEL Technology Ctr., America, LLC (United States)


Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood; Eric M. Panning, Editor(s)

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