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Proceedings Paper

Investigation of a methodology for in-film defects detection on film coated blank wafers
Author(s): Akiko Kiyotomi; Arnaud Dauendorffer; Satoru Shimura; Shinobu Miyazaki; Takemasa Miyagi; Shigeru Ota; Koji Haneda; Oksen Baris; Junwei Wei
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Paper Abstract

Multi-patterning is one of the commonly used processes to shrink device node dimensions. With the miniaturization of the device node and the increasing number of coated layers and lithography processes, needs for defect reduction and control are getting stronger. Although there are needs for detecting in-film defects during the lithography process, it is difficult to verify in-film defects detected by an optical inspection tool because in-film defects usually appear as SEM Non-Visuals (SNV) during defect review using a scanning electron microscope (SEM). This makes the tuning of optical inspection tools difficult since these defects may be considered as noise. However, if these defects are “real defects”, they will have a negative impact to manufacturing yield. In this paper, we investigate a new methodology to detect in-film defects with high sensitivity utilizing a broadband plasma inspection tool. This methodology is expected to allow the early detection of in-film defects before the pattern formation, hence improving device manufacturing yield.

Paper Details

Date Published: 2 April 2014
PDF: 7 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905024 (2 April 2014); doi: 10.1117/12.2045737
Show Author Affiliations
Akiko Kiyotomi, Tokyo Electron Kyushu Ltd. (Japan)
Arnaud Dauendorffer, Tokyo Electron Kyushu Ltd. (Japan)
Satoru Shimura, Tokyo Electron Kyushu Ltd. (Japan)
Shinobu Miyazaki, Tokyo Electron Kyushu Ltd. (Japan)
Takemasa Miyagi, KLA-Tencor Corp. (United States)
Shigeru Ota, KLA-Tencor Corp. (United States)
Koji Haneda, KLA-Tencor Corp. (United States)
Oksen Baris, KLA-Tencor Corp. (United States)
Junwei Wei, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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