Share Email Print
cover

Proceedings Paper

REBL DPG lenslet structure: design for charging prevention
Author(s): Shy-Jay Lin; T. I. Bao; C. W. Lu; S.-C. Wang; T. C. Chien; J.-J. Shin; Burn J. Lin; Mark A. McCord; Alan Brodie; Allen Carroll; Luca Grella
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

KLA-Tencor is currently developing Reflective Electron Beam Lithography (REBL), targeted as a production worthy multiple electron beam tool for next generation high volume lithography. The Digital Pattern Generator (DPG) integrated with CMOS and MEMS lenslets is a critical part of REBL. Previously, KLA-Tencor reported on progress towards a REBL tool for maskless lithography below the 10 nm technology node. However, the MEMS lenslet structure suffered from charging up during writing, requiring the usage of a charge drain coating. Since then, the TSMC multiple e-beam team and the KLA-Tencor REBL team have worked together to further develop the DPG for direct write lithography. In this paper, we introduce a hollow-structure MEMS lenslet array that inherently prevents charging during writing, and preliminary verification results are also presented.

Paper Details

Date Published: 28 March 2014
PDF: 4 pages
Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491X (28 March 2014); doi: 10.1117/12.2045416
Show Author Affiliations
Shy-Jay Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
T. I. Bao, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. W. Lu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
S.-C. Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
T. C. Chien, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
J.-J. Shin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Burn J. Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Mark A. McCord, KLA-Tencor Corp. (United States)
Alan Brodie, KLA-Tencor Corp. (United States)
Allen Carroll, KLA-Tencor Corp. (United States)
Luca Grella, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 9049:
Alternative Lithographic Technologies VI
Douglas J. Resnick; Christopher Bencher, Editor(s)

© SPIE. Terms of Use
Back to Top