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Proceedings Paper

EUV patterned mask inspection with an advanced projection electron microscope (PEM) system
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Paper Abstract

The framework and the current status of a newly developed PEM pattern inspection system are presented. A die-to-die defect detection sensitivity of the developing system is investigated. A programmed defect mask was used for demonstrating the performance of the system. Defect images were obtained as difference images by comparing PEM images with-defects to the PEM images without-defects. The image-processing system was also developed for die-to-die inspection. A targeted inspection throughput of 19-hour inspection per mask with 16nm pixel size for image capture was attained. Captured image of 28 nm intrusion defect in hp 64 nm L/S pattern was used for detection. The defect is clearly identified by the image processing. But several false defects are also detected. To improve the defect detection sensitivity to reach the targeted level of achieving a higher than 10 S/N value at 16 nm defect size, by applying a higher current density and a developed inspection algorithm adjustment is, currently an on-going program.

Paper Details

Date Published: 17 April 2014
PDF: 7 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90480Z (17 April 2014); doi: 10.1117/12.2045412
Show Author Affiliations
Ryoichi Hirano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Susumu Iida, EUVL Infrastructure Development Ctr., Inc. (Japan)
Tsuyoshi Amano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Tsuneo Terasawa, EUVL Infrastructure Development Ctr., Inc. (Japan)
Hidehiro Watanabe, EUVL Infrastructure Development Ctr., Inc. (Japan)
Masahiro Hatakeyama, EBARA Corp. (Japan)
Takeshi Murakami, EBARA Corp. (Japan)
Kenji Terao, EBARA Corp. (Japan)


Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood; Eric M. Panning, Editor(s)

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