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Proceedings Paper

The damage assessment methodology in cooperation with smart sensors and inspection robots
Author(s): Yoshihiro Nitta; Masami Ishida; Toshio Onai; Morimasa Watakabe; Akira Nishitani; Chisa Matsui
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Paper Abstract

This paper proposes a damage assessment methodology for the non-structural elements, especially the ceiling, in cooperation with the smart sensors and the inspection blimp robot with the Wi-Fi camera. The developed smart sensors use the infrared LEDs in sending the measured data to the inspection blimp robot. The inspection blimp robot integrated in the proposed system has a Wi-Fi camera and an infrared remote control receiver for receiving the data from the smart sensor. In the proposed methodology, the distributed smart sensors firstly detect the damage occurrence. Next, the inspection blimp robots can gather the data from the smart sensors, which transmit the measured data by using an infrared remote control receiver and LED signals. The inspection blimp robot also can inspect the damage location and captures the photographic image of the damage condition. The inspection blimp robot will be able to estimate the damage condition without any process of engineers’ on-site-inspection involved. To demonstrate the effectiveness of the inspection blimp robot, the blimp robot is utilized to estimate the aging ceiling of a real structure. For demonstrating the feasibility or possibility of the proposed damage assessment methodology in cooperation with the smart sensors and the inspection blimp robot, the conceptual laboratory experiment is conducted. The proposed methodology will provide valuable information for the repair and maintenance decision making of a damaged structure.

Paper Details

Date Published: 8 March 2014
PDF: 6 pages
Proc. SPIE 9062, Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014, 906210 (8 March 2014); doi: 10.1117/12.2045000
Show Author Affiliations
Yoshihiro Nitta, Ashikaga Institute of Technology (Japan)
Masami Ishida, Ashikaga Institute of Technology (Japan)
Toshio Onai, Ashikaga Institute of Technology (Japan)
Morimasa Watakabe, Toda Corp. (Japan)
Akira Nishitani, Waseda Univ. (Japan)
Chisa Matsui, Waseda Univ. (Japan)


Published in SPIE Proceedings Vol. 9062:
Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014
Wolfgang Ecke; Kara J. Peters; Norbert G. Meyendorf; Theodoros E. Matikas, Editor(s)

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