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Proceedings Paper

Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
Author(s): C. Koos; W. Freude; N. Lindenmann; S. Koeber; T. Hoose; M. R. Billah
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Paper Abstract

Photonic wire bonding exploits three-dimensional (3D) two-photon lithography to fabricate single-mode connections between nanophotonic circuits that are located on different chips. The shape of the photonic wire bonds can be adjusted to the positions of the chips such that high-precision alignment becomes obsolete. The technique enables photonic multi-chip modules that combine the strengths of different optical integration platforms.

Paper Details

Date Published: 6 March 2014
PDF: 10 pages
Proc. SPIE 8970, Laser 3D Manufacturing, 897008 (6 March 2014); doi: 10.1117/12.2044327
Show Author Affiliations
C. Koos, Karlsruhe Institute of Technology (Germany)
W. Freude, Karlsruhe Institute of Technology (Germany)
N. Lindenmann, Karlsruhe Institute of Technology (Germany)
S. Koeber, Karlsruhe Institute of Technology (Germany)
T. Hoose, Karlsruhe Institute of Technology (Germany)
M. R. Billah, Karlsruhe Institute of Technology (Germany)


Published in SPIE Proceedings Vol. 8970:
Laser 3D Manufacturing
Henry Helvajian; Alberto Piqué; Martin Wegener; Bo Gu, Editor(s)

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