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Proceedings Paper

Improved test setup for MEMS mechanical strength investigations and fabrication process qualification
Author(s): T. Bandi; X. Maeder; A. Dommann; H. Shea; A. Neels
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Paper Abstract

The mechanical stability of silicon MEMS dies is strongly influenced by the microfabrication processes, especially grinding, dicing and etching, which leave characteristic damage (defects, cracks, dislocations…) in the substrate material. Specially designed mechanical tests are used to assess the resistance of micro-structures to monotonic and cyclic loading. We report on the development progress of a micromechanical test bench for reliability assessment of microstructures in 2-, 3- and 4-point bending configurations. Strain distributions and defects in micron-sized silicon devices can be investigated by in-situ testing in combination with high-resolution x-ray diffraction measurements for experimentally assessing the strain distribution.

Paper Details

Date Published: 7 March 2014
PDF: 7 pages
Proc. SPIE 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII, 897509 (7 March 2014); doi: 10.1117/12.2044212
Show Author Affiliations
T. Bandi, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)
Ecole Polytechnique Fédérale de Lausanne (Switzerland)
X. Maeder, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)
A. Dommann, EMPA (Switzerland)
H. Shea, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
A. Neels, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)


Published in SPIE Proceedings Vol. 8975:
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
Herbert R. Shea; Rajeshuni Ramesham, Editor(s)

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