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Proceedings Paper

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects
Author(s): Dimitrios Apostolopoulos; Paraskevas Bakopoulos; Dimitrios Kalavrouziotis; Giannis Giannoulis; Giannis Kanakis; Nikos Iliadis; Christos Spatharakis; Johan Bauwelinck; Hercules Avramopoulos
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Paper Abstract

New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of opticalinterconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects. The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud. The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies.

Paper Details

Date Published: 8 March 2014
PDF: 15 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910D (8 March 2014); doi: 10.1117/12.2042586
Show Author Affiliations
Dimitrios Apostolopoulos, National Technical Univ. of Athens (Greece)
Paraskevas Bakopoulos, National Technical Univ. of Athens (Greece)
Dimitrios Kalavrouziotis, National Technical Univ. of Athens (Greece)
Giannis Giannoulis, National Technical Univ. of Athens (Greece)
Giannis Kanakis, National Technical Univ. of Athens (Greece)
Nikos Iliadis, National Technical Univ. of Athens (Greece)
Christos Spatharakis, National Technical Univ. of Athens (Greece)
Johan Bauwelinck, Univ. Gent (Belgium)
Hercules Avramopoulos, National Technical Univ. of Athens (Greece)


Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)

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