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Proceedings Paper

Low loss coupling and splicing of standard single mode fibers with all-solid soft-glass microstructured fibers for supercontinuum generation
Author(s): M. Murawski; G. Stępniewski; T. Tenderenda; M. Napierała; Z. Hołdyński; L. Szostkiewicz; M. Slowikowski; M. Szymanski; L. Ostrowski; L. R. Jaroszewicz; R. Buczyński; T. Nasiłowski
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Paper Abstract

In this work we would like to present the results of low loss coupling of a novel soft glass fiber for super continuum generation with standard single mode fiber by a filament splicing method. For our experiment we used an all solid soft glass microstructured fiber (MSF) made from a composition of F2 lead-silicate glass and NC21 borosilicate glass. The structure and material properties of the fiber were optimized to achieve all normal dispersion (ND) flattened around 1560 nm, which offers two general advantages for supercontinuum generation. The ND supercontinuum avoids soliton dynamics, hence it is less sensitive to pump laser shot noise and has larger degree of coherence than supercontinuum in the anomalous dispersion range. Furthermore flattening around 1560 nm indicates optimal supercontinuum pump wavelength, which is readily available from erbium doped femtosecond fiber lasers. Using Vytran splicing station (GPX3400) we were able to achieve repeatable splice loss between a standard fused-silica single mode fiber (SMF28) and the low-melting-temperature soft glass MSF as low as 2.12 dB @1310 nm and 1.94 dB @ 1550 nm. The developed very low loss splicing technology together with the above mentioned all solid soft glass MSF advantages give very promising perspectives for commercial applications.

Paper Details

Date Published: 7 March 2014
PDF: 6 pages
Proc. SPIE 8982, Optical Components and Materials XI, 898228 (7 March 2014); doi: 10.1117/12.2041677
Show Author Affiliations
M. Murawski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
G. Stępniewski, Institute of Electronic Materials Technology (Poland)
Univ. of Warsaw (Poland)
T. Tenderenda, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Napierała, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
Z. Hołdyński, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
L. Szostkiewicz, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Slowikowski, InPhoTech Ltd. (Poland)
M. Szymanski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
L. Ostrowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
L. R. Jaroszewicz, Military Univ. of Technology (Poland)
R. Buczyński, Institute of Electronic Materials Technology (Poland)
Univ. of Warsaw (Poland)
T. Nasiłowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)


Published in SPIE Proceedings Vol. 8982:
Optical Components and Materials XI
Michel J. F. Digonnet; Shibin Jiang, Editor(s)

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