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Proceedings Paper

Heterogeneous MEMS device assembly and integration
Author(s): Patrice Topart; Francis Picard; Samir Ilias; Christine Alain; Claude Chevalier; Bruno Fisette; Jacques E. Paultre; Francis Généreux; Mathieu Legros; Jean-François Lepage; Christian Laverdière; Linh Ngo Phong; Jean-Sol Caron; Yan Desroches
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Paper Abstract

In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

Paper Details

Date Published: 7 March 2014
PDF: 13 pages
Proc. SPIE 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII, 89750E (7 March 2014); doi: 10.1117/12.2041576
Show Author Affiliations
Patrice Topart, INO (Canada)
Francis Picard, INO (Canada)
Samir Ilias, INO (Canada)
Christine Alain, INO (Canada)
Claude Chevalier, INO (Canada)
Bruno Fisette, INO (Canada)
Jacques E. Paultre, INO (Canada)
Francis Généreux, INO (Canada)
Mathieu Legros, INO (Canada)
Jean-François Lepage, Defence Research and Development Canada (Canada)
Christian Laverdière, Defence Research and Development Canada (Canada)
Linh Ngo Phong, Canadian Space Agency (Canada)
Jean-Sol Caron, INO (Canada)
Yan Desroches, INO (Canada)

Published in SPIE Proceedings Vol. 8975:
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
Herbert R. Shea; Rajeshuni Ramesham, Editor(s)

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