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Proceedings Paper

Vertical transitions between transmission lines and waveguides in multilayer liquid crystal polymer (LCP) substrates
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Paper Abstract

In this paper we present two vertical transitions, in multilayer LCP substrates for millimeter wave (mmW) imaging application. The first transition is from conductor-backed co-planar waveguide (CBCPW) to strip line, and the second one connects CBCPW to substrate integrated waveguide (SIW). The multilayer structure consists of three LCP layers and four metal claddings. The CBCPW is designed on the top LCP layer, the strip line is sandwiched by the top and middle layers, and the SIW is built within the middle and bottom layers. Micro vias construct the side wall for the SIW, and electrically connect the transmission lines and waveguides. Both of the transitions perform low loss and low reflection at 77 GHz. They can efficiently connect the passive and active components in the front-end RF module of our mmW imager. Additionally, they may have promising application in high-performance systems, requiring high density, low size, weight, and power (SWaP).

Paper Details

Date Published: 7 March 2014
PDF: 7 pages
Proc. SPIE 8985, Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications VII, 898514 (7 March 2014); doi: 10.1117/12.2040381
Show Author Affiliations
Yifei Zhang, Univ. of Delaware (United States)
Shouyuan Shi, Univ. of Delaware (United States)
Rick D. Martin, Univ. of Delaware (United States)
Dennis W. Prather, Univ. of Delaware (United States)


Published in SPIE Proceedings Vol. 8985:
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications VII
Laurence P. Sadwick; Créidhe M. O'Sullivan, Editor(s)

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