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Proceedings Paper

Efficient and scalable single mode waveguide coupling on silicon based substrates
Author(s): E. Mohammed; R. Tseng; B. Rawlings; S. Liff; I. Ban; W. McFarlane; M. Reshotko; P. Chang
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Paper Abstract

One of the key challenges in Silicon based optical interconnect system remains to be the efficient coupling of optical signals from the submicron size on-chip waveguides to standard single mode (SM) fibers with low insertion loss (IL) and relaxed alignment tolerance. Large optical alignment tolerance allows optical connectors to be attached to on-chip waveguides passively using standard semiconductor pick-and-place assembly tools that have placement accuracies of 10- 15μm. To facilitate the assembly, optical fiber coupling elements need to be modular and compact. They have to also have low profile to avoid blocking air flow or mechanical interference with other elements of the package. In this paper we report the development of a two-dimensional (2D) SM optical fiber coupling architecture that consists of Si based photonic lightwave circuit (PLC) substrate and a high-density micro-lensed fiber optic connector. The system is compact, efficient and has large optical alignment tolerance. At 1300nm an insertion loss of 2.4dB and 1.5dB was measured for the PLC module and the fiber optic connector, respectively. When the PLC module and connector was aligned together, a total insertion loss of 7.8dB was demonstrated with x,y alignment tolerance of 40μm for 1dB optical loss. The SM optical coupling architecture presented here is scalable, alignment tolerant and has the potential to be manufactured in high volume. To our knowledge, such a system has not been reported in the literature so far.

Paper Details

Date Published: 8 March 2014
PDF: 8 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910G (8 March 2014); doi: 10.1117/12.2040143
Show Author Affiliations
E. Mohammed, Intel Corp. (United States)
R. Tseng, Intel Corp. (United States)
B. Rawlings, Intel Corp. (United States)
S. Liff, Intel Corp. (United States)
I. Ban, Intel Corp. (United States)
W. McFarlane, Intel Corp. (United States)
M. Reshotko, Intel Corp. (United States)
P. Chang, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)

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