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Proceedings Paper

Advanced packaging methods for high-power LED modules
Author(s): Rafael C. Jordan; Constanze Weber; Christian Ehrhardt; Martin Wilke
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Paper Abstract

LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.

Paper Details

Date Published: 27 February 2014
PDF: 12 pages
Proc. SPIE 9003, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XVIII, 90030M (27 February 2014); doi: 10.1117/12.2040076
Show Author Affiliations
Rafael C. Jordan, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Constanze Weber, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Christian Ehrhardt, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Martin Wilke, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 9003:
Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XVIII
Klaus P. Streubel; Heonsu Jeon; Li-Wei Tu; Martin Strassburg, Editor(s)

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