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Proceedings Paper

Investigation of a novel approach for the cross-linking characterization of SU-8 photoresist materials by means of optical dispersion measurements
Author(s): Ch. Taudt; T. Baselt; E. Koch; P. Hartmann
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Paper Abstract

The increase in efficiency and precision in the production of semiconductor structures under the use of polymeric materials like SU-8 is crucial in securing the technological innovation within this industry. The manufacturing of structures on wafers demands a high quality of materials, tools and production processes. In particular, deviations in the materials' parameters (e.g. cross-linking state, density or mechanical properties) could lead to subsequent problems such as a reduced lifetime of structures and systems. In particular problems during the soft and post-exposure bake process can lead to an inhomogeneous distribution of material properties. This paper describes a novel approach for the characterization of SU-8 material properties in relation to a second epoxy-based material of different cross-linking by the measurement of optical dispersion within the material. A white-light interferometer was used. In particular the setup consisted of a white-light source, a Michelson-type interferometer and a spectrometer. The investigation of the dispersion characteristics was carried out by the detection of the equalization wavelength for different positions of the reference arm in a range from 400 to 900 nm. The measured time delay due to dispersion ranges from 850 to 1050 ps/m. For evaluation purposes a 200μm SU-8 sample was characterized in the described setup regarding its dispersion characteristics in relation to bulk epoxy material. The novel measurement approach allowed a fast and high-resolution material characterization for SU-8 micro structures which was suitable for integration in production lines. The outlook takes modifications of the experimental setup regarding on-wafer measurements into account.

Paper Details

Date Published: 7 March 2014
PDF: 7 pages
Proc. SPIE 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII, 89750A (7 March 2014); doi: 10.1117/12.2039052
Show Author Affiliations
Ch. Taudt, Westsächsische Hochschule Zwickau (Germany)
Technische Univ. Dresden (Germany)
T. Baselt, Westsächsische Hochschule Zwickau (Germany)
E. Koch, Technische Univ. Dresden (Germany)
P. Hartmann, Westsächsische Hochschule Zwickau (Germany)

Published in SPIE Proceedings Vol. 8975:
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
Herbert R. Shea; Rajeshuni Ramesham, Editor(s)

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