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Proceedings Paper

Characteristics of the heat resistant FBG sensor under laser cladding condition
Author(s): A. Nishimura; T. Terada
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Paper Abstract

We have developed heat resistant strain sensors using laser processing techniques. The application is aimed at structural health monitoring for high temperature piping systems. This situation requires extraordinary durability such as radiation resistance and noise isolation due to adverse conditions caused by nuclear reactions or electro-magnetic pulses. We proposed that a Fiber Bragg Grating (FBG) sensor made by femtosecond laser processing could be the best candidate. The combination of fabric reinforcement and a heatproof adhesive mold successfully protected the fragile optical fiber once the fiber was installed on the piping material’s surface. To make the best use of the heat-resistant characteristic, we fixed the FBG sensor by metal mold. A groove was processed onto the surface of a SUS metal plate with a grindstone. We used a Quasi-CW laser to weld a filler wire onto the plate. The optical fiber was situated under the filler wire before was heated by laser pulses with 10 joule energy and a duration of 10 ms. A series of weld pool formed a sealing clad on the groove. The FBG sensor was buried at a depth of 1 mm over a length of 1 cm. No degradation in its reflection spectra was detected before and after the processing. The FBG sensor can detect the vibration of the plate caused by impact shocks. In this paper, the Bragg peak shift of the FBG sensor under laser cladding condition has been discussed.

Paper Details

Date Published: 20 February 2014
PDF: 7 pages
Proc. SPIE 8963, High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications III, 896307 (20 February 2014); doi: 10.1117/12.2038917
Show Author Affiliations
A. Nishimura, Japan Atomic Energy Agency (Japan)
T. Terada, Japan Atomic Energy Agency (Japan)

Published in SPIE Proceedings Vol. 8963:
High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications III
Friedhelm Dorsch, Editor(s)

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