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Proceedings Paper

Laser thin film ablation with multiple beams and tailored beam profiles
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Paper Abstract

For thin film ablation one can often not take full advantage of the relatively high output power and high pulse energy of lasers. A solution might be the use of parallel processing technique with multiple beams which help to increase process speed and to save process costs. Within this contribution we demonstrate thin film scribing of GZO and ITO which shows the potential of parallel processing combined with Top-hat beam shaping. The beam shaping optic provides process optimized beam profiles leading to a more efficient process and an improved ablation quality.

Paper Details

Date Published: 6 March 2014
PDF: 13 pages
Proc. SPIE 8967, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX, 89670P (6 March 2014); doi: 10.1117/12.2038572
Show Author Affiliations
Stefan Rung, Univ. of Applied Sciences Aschaffenburg (Germany)
Christian Bischoff, TOPAG Lasertechnik GmbH (Germany)
Erwin Jäger, TOPAG Lasertechnik GmbH (Germany)
Udo Umhofer, TOPAG Lasertechnik GmbH (Germany)
Ralf Hellmann, Univ. of Applied Sciences Aschaffenburg (Germany)


Published in SPIE Proceedings Vol. 8967:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX
Yoshiki Nakata; Xianfan Xu; Stephan Roth; Beat Neuenschwander, Editor(s)

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