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Proceedings Paper

Wafer-level vacuum-packaged two-axis MEMS scanning mirror for pico-projector application
Author(s): Ulrich Hofmann; Frank Senger; Joachim Janes; Christian Mallas; Vanessa Stenchly; Thomas von Wantoch; Hans-Joachim Quenzer; Manfred Weiss
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Paper Abstract

Hermetic wafer level packaging of optical MEMS scanning mirrors is essential for mass-market applications. It is the key to enable reliable low-cost mass producible scanning solutions. Vacuum packaging of resonant MEMS scanning mirrors widens the parameter range specifically with respect to scan angle and scan frequency. It also allows extending the utilizable range of mirror aperture size based on the fact that the energy of the high-Q oscillator can be effectively conserved and accumulated. But there are also some drawbacks associated with vacuum packaging. This paper discusses the different advantageous and disadvantageous aspects of vacuum packaging of MEMS scanning mirrors with respect to laser projection displays. Improved MEMS scanning mirror designs are being presented which focus on overcoming previous limitations. Finally an outlook is presented on the suitability of this technology for very large aperture scanning mirrors to be used in high power laser applications.

Paper Details

Date Published: 7 March 2014
PDF: 14 pages
Proc. SPIE 8977, MOEMS and Miniaturized Systems XIII, 89770A (7 March 2014); doi: 10.1117/12.2038249
Show Author Affiliations
Ulrich Hofmann, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Frank Senger, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Joachim Janes, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Christian Mallas, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Vanessa Stenchly, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Thomas von Wantoch, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Hans-Joachim Quenzer, Fraunhofer-Institut für Siliziumtechnologie (Germany)
Manfred Weiss, Fraunhofer-Institut für Siliziumtechnologie (Germany)

Published in SPIE Proceedings Vol. 8977:
MOEMS and Miniaturized Systems XIII
Wibool Piyawattanametha; Yong-Hwa Park, Editor(s)

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