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Proceedings Paper

The investigation of electrolytic surface roughening for PCB copper foil
Author(s): Shuo-Jen Lee; Chao-Kai Liu
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Paper Abstract

This study is the application of the principle of electrochemical. The anodic dissolution has no concentration polarization. Hence, electrolyte life is substantially increased. The waste copper is high in ion concentration with a recovery value. As compared with the current PCB chemical pre-treatment method, it may have advantages of cost-saving, improvement of overall efficiency, reduction of production costs and reduction of the amount of waste generated. In the development of the copper foil for electrochemical roughening process, the use of electrolysis reaction affects the copper surface dissolution to form a unique bump coarsening. It will increase in the surface area of the copper foil to improve dry film solder mask and the adhesion between the copper surfaces. Four electrolytes, two neutral salts and two acids, were selected to explore the best of the electrolytic roughening parameters of temperature, time and voltage. The surface roughness and the surface morphology of the copper foil were measured before and after the electrolytic surface roughening. Finally, after repeated experiments, electrolytes A and B copper generates obvious inter-granular corrosion, resulting in a rough surface similar to the chemical pre-treatment. On the other hands, the surface morphology resulted from electrolytes C and D appears more like pitting. Both electrolytic could generate surface roughness of Ra 0.3 um roughened copper surface higher than industrial standard.

Paper Details

Date Published: 10 October 2013
PDF: 6 pages
Proc. SPIE 8916, Sixth International Symposium on Precision Mechanical Measurements, 89161K (10 October 2013); doi: 10.1117/12.2036879
Show Author Affiliations
Shuo-Jen Lee, Yuan Ze Univ. (Taiwan, China)
Chao-Kai Liu, Yuan Ze Univ. (Taiwan, China)


Published in SPIE Proceedings Vol. 8916:
Sixth International Symposium on Precision Mechanical Measurements
Shenghua Ye; Yetai Fei, Editor(s)

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