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Proceedings Paper

Design of active temperature compensated composite free-free beam MEMS resonators in a standard process
Author(s): George Xereas; Vamsy P. Chodavarapu
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Paper Abstract

Frequency references are used in almost every modern electronic device including mobile phones, personal computers, and scientific and medical instrumentation. With modern consumer mobile devices imposing stringent requirements of low cost, low complexity, compact system integration and low power consumption, there has been significant interest to develop batch-manufactured MEMS resonators. An important challenge for MEMS resonators is to match the frequency and temperature stability of quartz resonators. We present 1MHz and 20MHz temperature compensated Free-Free beam MEMS resonators developed using PolyMUMPS, which is a commercial multi-user process available from MEMSCAP. We introduce a novel temperature compensation technique that enables high frequency stability over a wide temperature range. We used three strategies: passive compensation by using a structural gold (Au) layer on the resonator, active compensation through using a heater element, and a Free-Free beam design that minimizes the effects of thermal mismatch between the vibrating structure and the substrate. Detailed electro-mechanical simulations were performed to evaluate the frequency response and Quality Factor (Q). Specifically, for the 20MHz device, a Q of 10,000 was obtained for the passive compensated design. Finite Element Modeling (FEM) simulations were used to evaluate the Temperature Coefficient of frequency (TCf) of the resonators between -50°C and 125°C which yielded +0.638 ppm/°C for the active compensated, compared to -1.66 ppm/°C for the passively compensated design and -8.48 ppm/°C for uncompensated design for the 20MHz device. Electro-thermo-mechanical simulations showed that the heater element was capable of increasing the temperature of the resonators by approximately 53°C with an applied voltage of 10V and power consumption of 8.42 mW.

Paper Details

Date Published: 7 March 2014
PDF: 10 pages
Proc. SPIE 8973, Micromachining and Microfabrication Process Technology XIX, 89730N (7 March 2014); doi: 10.1117/12.2036239
Show Author Affiliations
George Xereas, McGill Univ. (Canada)
Vamsy P. Chodavarapu, McGill Univ. (Canada)


Published in SPIE Proceedings Vol. 8973:
Micromachining and Microfabrication Process Technology XIX
Mary Ann Maher; Paul J. Resnick, Editor(s)

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