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Proceedings Paper

DSPI system based on spatial carrier phase shifting technique
Author(s): Yonghong Wang; Junrui Li; Jianfei Sun; Lianxiang Yang
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Paper Abstract

Digital Speckle Pattern Interferometry (DSPI) is an optical method for measuring small displacement and deformation. It allows whole field, non-contacting measurement of micro deformation. Traditional Temporal phase shifting has been used for quantitative analyses in DSPI. The technique requires the recording of at least three phase-shifted interferograms, which must be taken sequentially. This can lead to disturbances by thermal and mechanical fluctuations during the required recording time. In addition, fast object deformations cannot be detected. In this paper a DSPI system using Spatial Carrier Phase Shifting (SCPS) technique is introduced, which is useful for extracting quantitative displacement data from the system with only two interferograms. The sensitive direction of this system refers to the illumination direction and observation direction. The frequencies of the spatial carrier relates to the angle between reference light and observation direction. Fourier transform is adopted in the digital evaluation to filter out the frequencies links to the deformation of testing object. The phase is obtained from the complex matrix formed by inverse Fourier transform, and the phase difference and deformation are calculated subsequently. Comparing with conventional temporal phase shifting, the technique can achieve measuring the vibration and transient deformation of testing object. Experiment set-ups and results are presented in this paper, and the experiment results have shown the effectiveness and advantages of the SCPS technique.

Paper Details

Date Published: 10 October 2013
PDF: 6 pages
Proc. SPIE 8916, Sixth International Symposium on Precision Mechanical Measurements, 89160O (10 October 2013); doi: 10.1117/12.2036179
Show Author Affiliations
Yonghong Wang, Hefei Univ. of Technology (China)
Junrui Li, Hefei Univ. of Technology (China)
Jianfei Sun, Hefei Univ. of Technology (China)
Lianxiang Yang, Hefei Univ. of Technology (United States)
Oakland Univ. (United States)


Published in SPIE Proceedings Vol. 8916:
Sixth International Symposium on Precision Mechanical Measurements
Shenghua Ye; Yetai Fei, Editor(s)

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