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Proceedings Paper

Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection
Author(s): I. Shishkovsky; V. Scherbakof; I. Volyansky
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Paper Abstract

The deposition of nano-size copper particles was carried out by means of ink-jet printing on the ceramic substrate (silicon and faience) using Nd+3:YAG laser. Glycerin and aqueous based nano copper inks were prepared and were inkjetted in this study. The sintered copper film had a grainy structure with neck-like junctions. The microstructure and soldering properties were examined using XRD, SEM-EDX and optical microscopy. The dependence of the electrical resistance of the ink-jetted copper interconnection lines on the parameters of laser sintering regimes was estimated.

Paper Details

Date Published: 28 November 2013
PDF: 6 pages
Proc. SPIE 9065, Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2013, 90650I (28 November 2013); doi: 10.1117/12.2035969
Show Author Affiliations
I. Shishkovsky, Samara State Univ. (Russian Federation)
P.N. Lebedev Physical Institute (Russian Federation)
V. Scherbakof, P.N. Lebedev Physical Institute (Russian Federation)
I. Volyansky, Samara State Univ. (Russian Federation)


Published in SPIE Proceedings Vol. 9065:
Fundamentals of Laser-Assisted Micro- and Nanotechnologies 2013
Vadim P. Veiko; Tigran A. Vartanyan, Editor(s)

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