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Proceedings Paper

Thermal cycling reliability of indirect hybrid HgCdTe infrared detectors
Author(s): Xing Chen; Kai He; Jian-xin Wang; Qin-yao Zhang
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Paper Abstract

Thermal cycling reliability is one of the most important issues whether the HgCdTe infrared focal plane array detectors can be applied to both military and civil fields. In this paper, a 3D finite element model for indirect hybrid HgCdTe infrared detectors is established. The thermal stress distribution and thermally induced warpage of the detector assembly as a function of the distance between the detector chip and Si-ROIC, the thickness and the materials properties of electrical lead board in cryogenic temperature are analyzed. The results show that all these parameters have influences on the thermal stress distribution and warpage of the detector assembly, especially the coefficient of thermal expansion(CTE) of electrical lead board. The thermal stress and warpage in the assembly can be avoided or minimized by choosing the appropriate electrical lead board. Additionally, the warpage of some indirect hybrid detectors assembly samples is measured in experiment. The experimental results are in good agreement with the simulation results, which verifies that the results are calculated by finite element method are reasonable.

Paper Details

Date Published: 11 September 2013
PDF: 6 pages
Proc. SPIE 8907, International Symposium on Photoelectronic Detection and Imaging 2013: Infrared Imaging and Applications, 890749 (11 September 2013); doi: 10.1117/12.2034661
Show Author Affiliations
Xing Chen, Shanghai Institute of Technical Physics (China)
Kai He, Shanghai Institute of Technical Physics (China)
Jian-xin Wang, Shanghai Institute of Technical Physics (China)
Qin-yao Zhang, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 8907:
International Symposium on Photoelectronic Detection and Imaging 2013: Infrared Imaging and Applications
Haimei Gong; Zelin Shi; Qian Chen; Jin Lu, Editor(s)

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