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Proceedings Paper

Governing equations for electro-conjugate fluid flow
Author(s): K. Hosoda; K. Takemura; K. Fukagata; S. Yokota; K. Edamura
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Paper Abstract

An electro-conjugation fluid (ECF) is a kind of dielectric liquid, which generates a powerful flow when high DC voltage is applied with tiny electrodes. This study deals with the derivation of the governing equations for electro-conjugate fluid flow based on the Korteweg-Helmholtz (KH) equation which represents the force in dielectric liquid subjected to high DC voltage. The governing equations consist of the Gauss's law, charge conservation with charge recombination, the KH equation, the continuity equation and the incompressible Navier-Stokes equations. The KH equation consists of coulomb force, dielectric constant gradient force and electrostriction force. The governing equation gives the distribution of electric field, charge density and flow velocity. In this study, direct numerical simulation (DNS) is used in order to get these distribution at arbitrary time. Successive over-relaxation (SOR) method is used in analyzing Gauss's law and constrained interpolation pseudo-particle (CIP) method is used in analyzing charge conservation with charge recombination. The third order Runge-Kutta method and conservative second-order-accurate finite difference method is used in analyzing the Navier-Stokes equations with the KH equation. This study also deals with the measurement of ECF ow generated with a symmetrical pole electrodes pair which are made of 0.3 mm diameter piano wire. Working fluid is FF-1EHA2 which is an ECF family. The flow is observed from the both electrodes, i.e., the flow collides in between the electrodes. The governing equation successfully calculates mean flow velocity in between the collector pole electrode and the colliding region by the numerical simulation.

Paper Details

Date Published: 7 December 2013
PDF: 12 pages
Proc. SPIE 8923, Micro/Nano Materials, Devices, and Systems, 89234Z (7 December 2013); doi: 10.1117/12.2033791
Show Author Affiliations
K. Hosoda, Keio Univ. (Japan)
K. Takemura, Keio Univ. (Japan)
K. Fukagata, Keio Univ. (Japan)
S. Yokota, Tokyo Institute of Technology (Japan)
K. Edamura, New Technology Management Co., Ltd (Japan)


Published in SPIE Proceedings Vol. 8923:
Micro/Nano Materials, Devices, and Systems
James Friend; H. Hoe Tan, Editor(s)

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