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Proceedings Paper

The NUC and blind pixel eliminating in the DTDI application
Author(s): Xiaofeng Su; FanSheng Chen; Sheng Da Pan; Xue Yi Gong; Yu Cui Dong
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Paper Abstract

AS infrared CMOS Digital TDI (Time Delay and integrate) has a simple structure, excellent performance and flexible operation, it has been used in more and more applications. Because of the limitation of the Production process level, the plane array of the infrared detector has a large NU (non-uniformity) and a certain blind pixel rate. Both of the two will raise the noise and lead to the TDI works not very well. In this paper, for the impact of the system performance, the most important elements are analyzed, which are the NU of the optical system, the NU of the Plane array and the blind pixel in the Plane array. Here a reasonable algorithm which considers the background removal and the linear response model of the infrared detector is used to do the NUC (Non-uniformity correction) process, when the infrared detector array is used as a Digital TDI. In order to eliminate the impact of the blind pixel, the concept of surplus pixel method is introduced in, through the method, the SNR (signal to noise ratio) can be improved and the spatial and temporal resolution will not be changed. Finally we use a MWIR (Medium Ware Infrared) detector to do the experiment and the result proves the effectiveness of the method.

Paper Details

Date Published: 7 December 2013
PDF: 12 pages
Proc. SPIE 8923, Micro/Nano Materials, Devices, and Systems, 89234M (7 December 2013); doi: 10.1117/12.2033714
Show Author Affiliations
Xiaofeng Su, Shanghai Institute of Technical Physics of the Chinese Academy of Sciences (China)
Univ. of Chinese Academy of Sciences (China)
FanSheng Chen, Shanghai Institute of Technical Physics (China)
Sheng Da Pan, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)
Xue Yi Gong, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)
Yu Cui Dong, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)


Published in SPIE Proceedings Vol. 8923:
Micro/Nano Materials, Devices, and Systems
James Friend; H. Hoe Tan, Editor(s)

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