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Proceedings Paper

The high speed low noise multi-data processing signal process circuit research of remote sensing
Author(s): Lei Su; Haibin Jiang; Wang Dong
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Paper Abstract

The high speed, low noise and integration characteristic are the main technology and the main development directions on the signal process circuit of the image sensor, especially in high resolution remote sensing. With these developments, the high noise limiting circuits, high speed data transfer system and the integrated design of the signal process circuit become more and more important. Therefore the requirement of the circuit system simulation is more and more important during the system design and PCB board design process. A CCD signal process circuit system which has the high speed, low noise and several selectable operate modes function was designed and certificated in this paper, during the CCD signal process circuit system design, simulation was made which include the signal integrity and the power integrity. The important devices such as FPGA and the DDR2 device were simulated, using the power integrity simulation the sensitive power planes of the FPGA on the PCB was modified to make the circuit operate more stabilize on a higher frequency. The main clock path and the high speed data path of the PCB board were simulated with the signal integrity. All the simulation works make the signal process circuit system’s image’s SNR value get higher and make the circuit system could operate well on higher frequency. In the board testing process, the PCB time diagrams were listed on the testing chapter and the wave’s parameter meets the request. The real time diagram and the simulated result of the PCB board was listed respectively. The CCD signal process circuit system’s images’ SNR (Signal Noise Ratio) value, the 14bit AFE slew rate and the data transfer frequency is listed in the paper respective.

Paper Details

Date Published: 21 August 2013
PDF: 8 pages
Proc. SPIE 8908, International Symposium on Photoelectronic Detection and Imaging 2013: Imaging Sensors and Applications, 89081D (21 August 2013); doi: 10.1117/12.2033396
Show Author Affiliations
Lei Su, Beijing Institute of Space Mechanics and Electricity (China)
Haibin Jiang, Beijing Institute of Space Mechanics and Electricity (China)
Wang Dong, Beijing Institute of Space Mechanics and Electricity (China)


Published in SPIE Proceedings Vol. 8908:
International Symposium on Photoelectronic Detection and Imaging 2013: Imaging Sensors and Applications
Jun Ohta; Nanjian Wu; Binqiao Li, Editor(s)

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