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Proceedings Paper

A study of phase defect measurement on EUV mask by multiple detectors CD-SEM
Author(s): Isao Yonekura; Hidemitsu Hakii; Shinya Morisaki; Tsutomu Murakawa; Soichi Shida; Masayuki Kuribara; Toshimichi Iwai; Jun Matsumoto; Takayuki Nakamura
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Paper Abstract

We have studied MVM (Multi Vision Metrology) -SEM® E3630 to measure 3D shape of defects. The four detectors (Detector A, B, C and D) are independently set up in symmetry for the primary electron beam axis. Signal processing of four direction images enables not only 2D (width) measurement but also 3D (height) measurement. At last PMJ, we have investigated the relation between the E3630’s signal of programmed defect on MoSi-HT and defect height measured by AFM (Atomic Force Microscope). It was confirmed that height of integral profile by this tool is correlated with AFM. It was tested that E3630 has capability of observing multilayer defect on EUV. We have investigated correlation with AFM of width and depth or height of multilayer defect. As the result of observing programmed defects, it was confirmed that measurement result by E3630 is well correlated with AFM. And the function of 3D view image enables to show nm order defect.

Paper Details

Date Published: 28 June 2013
PDF: 9 pages
Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 870110 (28 June 2013); doi: 10.1117/12.2031846
Show Author Affiliations
Isao Yonekura, Toppan Printing Co., Ltd. (Japan)
Hidemitsu Hakii, Toppan Printing Co., Ltd. (Japan)
Shinya Morisaki, Toppan Printing Co., Ltd. (Japan)
Tsutomu Murakawa, Advantest Corp. (Japan)
Soichi Shida, Advantest Corp. (Japan)
Masayuki Kuribara, Advantest Corp. (Japan)
Toshimichi Iwai, Advantest Corp. (Japan)
Jun Matsumoto, Advantest Corp. (Japan)
Takayuki Nakamura, Advantest Corp. (Japan)

Published in SPIE Proceedings Vol. 8701:
Photomask and Next-Generation Lithography Mask Technology XX
Kokoro Kato, Editor(s)

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