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Proceedings Paper

Improvement of EUVL mask structure with black border of etched multilayer
Author(s): Kosuke Takai; Koji Murano; Eiji Yamanaka; Shinji Yamaguchi; Masato Naka; Takashi Kamo; Naoya Hayashi
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Paper Abstract

For EUVL mask with thinner absorber, it is necessary to make black border area in order to suppress the leakage of the EUV light from the adjacent exposure shots Black border of etched multilayer is promising structure in terms of light-shield capability and mask process simplicity. However, EUVL masks with this structure do not have electrical conductivity between the inside and the outside of black border. Inspection area including device patterns belongs to the inside of the black border. In case that quality check for EUVL masks is performed with E-beam inspection, the area is floating. As a result, electrification to mask pattern occurs and causes degradation of E-beam inspection accuracy when the mask is inspected by E-beam inspection tool. In this paper, we refine EUVL mask structure with black border of etched multilayer in order to improve electrical conductivity. We will show evaluation results of E-beam inspection accuracy, and discuss specifications of electrically conductive black border area.

Paper Details

Date Published: 2 August 2013
PDF: 8 pages
Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 87010Y (2 August 2013); doi: 10.1117/12.2031582
Show Author Affiliations
Kosuke Takai, Toshiba Corp. (Japan)
Koji Murano, Toshiba Corp. (Japan)
Eiji Yamanaka, Toshiba Corp. (Japan)
Shinji Yamaguchi, Toshiba Corp. (Japan)
Masato Naka, Toshiba Corp. (Japan)
Takashi Kamo, Toshiba Corp. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 8701:
Photomask and Next-Generation Lithography Mask Technology XX
Kokoro Kato, Editor(s)

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