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Proceedings Paper

Investigation of EUVL reticle capping layer peeling under wet cleaning
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Paper Abstract

In the absence of a pellicle, an EUVL reticle is expected to withstand up to 100 cleaning cycles. EUVL reticles constitute a complex multi-layer structure with extremely sensitive materials which are prone to damage during cleaning. The 2.5 nm thin Ru capping layer has been reported to be most sensitive to repeated cleaning, especially when exposed to aggressive dry etch or strip chemicals [1]. Such a Ru film exhibits multiple modes of failure under wet cleaning processes. In this study we investigated the Ru peeling effect. IR-induced thermo-stress in the multilayer and photochemical-induced radical attack on the surface are investigated as the two most dominant contributors to Ru damage in cleaning. Results of this investigation are presented and corrective actions are proposed.

Paper Details

Date Published: 3 October 2013
PDF: 10 pages
Proc. SPIE 8880, Photomask Technology 2013, 888010 (3 October 2013); doi: 10.1117/12.2031430
Show Author Affiliations
Sherjang Singh, SUSS MicroTec Inc. (United States)
Davide Dattilo, SUSS MicroTec Photomask Equipment GmbH & Co. KG (Germany)
Uwe Dietze, SEMATECH EUV Lithography Ctr. (United States)
Arun John Kadaksham, SEMATECH EUV Lithography Ctr. (United States)
Il-Yong Jang, SEMATECH EUV Lithography Ctr. (United States)
Frank Goodwin, SEMATECH EUV Lithography Ctr. (United States)

Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)

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