Share Email Print

Proceedings Paper

Reactive impulse plasma ablation deposited barium titanate thin films on silicon
Author(s): A. Werbowy; P. Firek; N. Kwietniewski; A. Olszyna
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Thin (100 nm) nanocrystalline dielectric films of lanthanum doped barium titanate were produced on Si substrates by means of reactive impulse plasma ablation deposition (IPD) from BaTiO3 + La2O3 (2 wt.%) target. Scanning electron microcopy and atomic force microscopy showed that the obtained layers were dense ceramics of uniform thickness with average roughness Ra = 2.045 nm and the average grain size of the order of 15 nm. Measurements of current-voltage (IV) characteristics of metal-insulator-semiconductor (MIS) structures, produced by evaporation of metal (Al) electrodes on top of barium titanate films, allowed to determine that the leakage current density and critical electric field intensity (EBR) of investigated layers ranged from 10-12 to 10-6 A cm-2 and from 0.2 to 0.5 MV cm-1, respectively. Capacitance-voltage (C-V) measurements of the same structures were performed in accumulation state showing that the dielectric constant value (εri) of films is of the order of 20.

Paper Details

Date Published: 25 July 2013
PDF: 9 pages
Proc. SPIE 8902, Electron Technology Conference 2013, 89022O (25 July 2013); doi: 10.1117/12.2031267
Show Author Affiliations
A. Werbowy, Warsaw Univ. of Technology (Poland)
P. Firek, Warsaw Univ. of Technology (Poland)
N. Kwietniewski, Warsaw Univ. of Technology (Poland)
A. Olszyna, Warsaw Univ. of Technology (Poland)

Published in SPIE Proceedings Vol. 8902:
Electron Technology Conference 2013
Pawel Szczepanski; Ryszard Kisiel; Ryszard S. Romaniuk, Editor(s)

© SPIE. Terms of Use
Back to Top