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Proceedings Paper

Silicon nanowires reliability and robustness investigation using AFM-based techniques
Author(s): Tomasz Bieniek; Grzegorz Janczyk; Paweł Janus; Piotr Grabiec; Marek Nieprzecki; Grzegorz Wielgoszewski; Magdalena Moczała; Teodor Gotszalk; Elizabeth Buitrago; Montserrat Fernandez-Bolaños Badia; Adrian M. Ionescu
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Paper Abstract

Silicon nanowires (SiNWs) have undergone intensive research for their application in novel integrated systems such as field effect transistor (FET) biosensors and mass sensing resonators profiting from large surface-to-volume ratios (nano dimensions). Such devices have been shown to have the potential for outstanding performances in terms of high sensitivity, selectivity through surface modification and unprecedented structural characteristics. This paper presents the results of mechanical characterization done for various types of suspended SiNWs arranged in a 3D array. The characterization has been performed using techniques based on atomic force microscopy (AFM). This investigation is a necessary prerequisite for the reliable and robust design of any biosensing system. This paper also describes the applied investigation methodology and reports measurement results aggregated during series of AFM-based tests.

Paper Details

Date Published: 25 July 2013
PDF: 6 pages
Proc. SPIE 8902, Electron Technology Conference 2013, 89022L (25 July 2013); doi: 10.1117/12.2031229
Show Author Affiliations
Tomasz Bieniek, Instytut Technologii Elektronowej (Poland)
Grzegorz Janczyk, Instytut Technologii Elektronowej (Poland)
Paweł Janus, Instytut Technologii Elektronowej (Poland)
Piotr Grabiec, Instytut Technologii Elektronowej (Poland)
Marek Nieprzecki, Instytut Technologii Elektronowej (Poland)
Grzegorz Wielgoszewski, Wrocław Univ. of Technology (Poland)
Magdalena Moczała, Wrocław Univ. of Technology (Poland)
Teodor Gotszalk, Wrocław Univ. of Technology (Poland)
Elizabeth Buitrago, EPFL (Switzerland)
Montserrat Fernandez-Bolaños Badia, EPFL (Switzerland)
Adrian M. Ionescu, EPFL (Switzerland)


Published in SPIE Proceedings Vol. 8902:
Electron Technology Conference 2013
Pawel Szczepanski; Ryszard Kisiel; Ryszard S. Romaniuk, Editor(s)

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