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Proceedings Paper

Selective deep wet etching of fused silica optical fibers for sensing applications
Author(s): Krzysztof Krogulski; Mateusz Śmietana; Norbert Kwietniewski; Krystian Król
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Paper Abstract

In the paper we discuss crucial aspects of selective deep wet etching technology of fused silica optical fibers. The technology includes preparation of the fiber, photolithography aiming to create a mask for etching, wet etching process and photoresist removal. We also discuss the influence of removing polyimide layer from the fiber, photoresist type, thickness of the photoresist and etching time. The developed technology allows for obtaining periodic variations in the fiber diameter resulting in formation of corrugated long-period grating (LPG). Introduction of strain induces appearing of attenuation peak in the transmission spectrum of the fiber. The developed technology can be also applied for fabrication of other optical fiber devices.

Paper Details

Date Published: 25 July 2013
PDF: 6 pages
Proc. SPIE 8902, Electron Technology Conference 2013, 89021K (25 July 2013); doi: 10.1117/12.2031149
Show Author Affiliations
Krzysztof Krogulski, Warsaw Univ. of Technology (Poland)
Mateusz Śmietana, Warsaw Univ. of Technology (Poland)
Norbert Kwietniewski, Warsaw Univ. of Technology (Poland)
Krystian Król, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 8902:
Electron Technology Conference 2013
Pawel Szczepanski; Ryszard Kisiel; Ryszard S. Romaniuk, Editor(s)

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