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Proceedings Paper

450mm wafer patterning with jet and flash imprint lithography
Author(s): Ecron Thompson; Paul Hellebrekers; Paul Hofemann; Dwayne L. LaBrake; Douglas J. Resnick; S. V. Sreenivasan
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Paper Abstract

The next step in the evolution of wafer size is 450mm. Any transition in sizing is an enormous task that must account for fabrication space, environmental health and safety concerns, wafer standards, metrology capability, individual process module development and device integration. For 450mm, an aggressive goal of 2018 has been set, with pilot line operation as early as 2016. To address these goals, consortiums have been formed to establish the infrastructure necessary to the transition, with a focus on the development of both process and metrology tools. Central to any process module development, which includes deposition, etch and chemical mechanical polishing is the lithography tool. In order to address the need for early learning and advance process module development, Molecular Imprints Inc. has provided the industry with the first advanced lithography platform, the Imprio® 450, capable of patterning a full 450mm wafer. The Imprio 450 was accepted by Intel at the end of 2012 and is now being used to support the 450mm wafer process development demands as part of a multi-year wafer services contract to facilitate the semiconductor industry’s transition to lower cost 450mm wafer production. The Imprio 450 uses a Jet and Flash Imprint Lithography (J-FILTM) process that employs drop dispensing of UV curable resists to assist high resolution patterning for subsequent dry etch pattern transfer. The technology is actively being used to develop solutions for markets including NAND Flash memory, patterned media for hard disk drives and displays. This paper reviews the recent performance of the J-FIL technology (including overlay, throughput and defectivity), mask development improvements provided by Dai Nippon Printing, and the application of the technology to a 450mm lithography platform.

Paper Details

Date Published: 9 September 2013
PDF: 8 pages
Proc. SPIE 8880, Photomask Technology 2013, 88800J (9 September 2013); doi: 10.1117/12.2029275
Show Author Affiliations
Ecron Thompson, Molecular Imprints, Inc. (United States)
Paul Hellebrekers, Molecular Imprints, Inc. (United States)
Paul Hofemann, Molecular Imprints, Inc. (United States)
Dwayne L. LaBrake, Molecular Imprints, Inc. (United States)
Douglas J. Resnick, Molecular Imprints, Inc. (United States)
S. V. Sreenivasan, Molecular Imprints, Inc. (United States)

Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)

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