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Proceedings Paper

Looking for simple engineering solutions in DFM patents
Author(s): Artur Balasinski
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Paper Abstract

Progress in IC technologies is usually based on costly improvements of process equipment. An alternative path is to look into opportunities based on the engineering disclosures, which can have a lot of potential in the Design-for- Manufacturing domain. This paper discusses six examples of such disclosures, filed in the 2010-2012 timeframe.

Paper Details

Date Published: 1 October 2013
PDF: 8 pages
Proc. SPIE 8886, 29th European Mask and Lithography Conference, 88860M (1 October 2013); doi: 10.1117/12.2028831
Show Author Affiliations
Artur Balasinski, Cypress Semiconductor Corp. (United States)

Published in SPIE Proceedings Vol. 8886:
29th European Mask and Lithography Conference
Uwe F. W. Behringer; Wilhelm Maurer, Editor(s)

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