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Proceedings Paper

Mask degradation monitoring with aerial mask inspector
Author(s): Wen-Jui Tseng; Yung-Ying Fu; Shih-Ping Lu; Ming-Sian Jiang; Jeffrey Lin; Clare Wu; Sivan Lifschitz; Aviram Tam
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Paper Abstract

As design rule continues to shrink, microlithography is becoming more challenging and the photomasks need to comply with high scanner laser energy, low CDU, and ever more aggressive RETs. This give rise to numerous challenges in the semiconductor wafer fabrication plants. Some of these challenges being contamination (mainly haze and particles), mask pattern degradation (MoSi oxidation, chrome migration, etc.) and pellicle degradation. Fabs are constantly working to establish an efficient methodology to manage these challenges mainly using mask inspection, wafer inspection, SEM review and CD SEMs. Aerial technology offers a unique opportunity to address the above mask related challenges using one tool. The Applied Materials Aera3TM system has the inherent ability to inspect for defects (haze, particles, etc.), and track mask degradation (e.g. CDU). This paper focuses on haze monitoring, which is still a significant challenge in semiconductor manufacturing, and mask degradation effects that are starting to emerge as the next challenge for high volume semiconductor manufacturers. The paper describes Aerial inspector (Aera3) early haze methodology and mask degradation tracking related to high volume manufacturing. These will be demonstrated on memory products. At the end of the paper we take a brief look on subsequent work currently conducted on the more general issue of photo mask degradation monitoring by means of an Aerial inspector.

Paper Details

Date Published: 28 June 2013
PDF: 10 pages
Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 87010B (28 June 2013); doi: 10.1117/12.2028101
Show Author Affiliations
Wen-Jui Tseng, Rexchip Corp. (Taiwan)
Yung-Ying Fu, Rexchip Corp. (Taiwan)
Shih-Ping Lu, Rexchip Corp. (Taiwan)
Ming-Sian Jiang, Rexchip Corp. (Taiwan)
Jeffrey Lin, Applied Materials (Taiwan)
Clare Wu, Applied Materials (Taiwan)
Sivan Lifschitz, Applied Materials (Israel)
Aviram Tam, Applied Materials (Israel)


Published in SPIE Proceedings Vol. 8701:
Photomask and Next-Generation Lithography Mask Technology XX
Kokoro Kato, Editor(s)

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