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Proceedings Paper

Relationship between coefficient of friction and surface roughness of wafer in nanomachining process
Author(s): Jun Li; Lei Xia; Pengpeng Li; Yongwei Zhu; Yuli Sun; Dunwen Zuo
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Paper Abstract

Fixed abrasive polishing technology can obtain a nanoscale surface and is one of the future nano machining directions. The coefficient of friction between the pad and the wafer in the polishing process can influence on the surface quality of the wafer. The relationship between the coefficient of friction and surface roughness of the wafer was investigated to improve the efficiency and surface quality. Based on the Florida model, the adhesion, asperity plough and abrasive plough from the pad in the polishing process was analyzed. The friction force per unit area was calculated by the properties of the pad and wafer. Based on the rod model, the actual contact area was calculated by the surface roughness and the properties of the pad and wafer. The relational model between the surface roughness of the wafer and the friction coefficient was established. The model was verified by the experiments of fixed abrasive polishing of BK7 glass. When the friction coefficient is less than 1.9, the data of the experiment and theory match very well in the comparison process.

Paper Details

Date Published: 9 August 2013
PDF: 6 pages
Proc. SPIE 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 87931Y (9 August 2013); doi: 10.1117/12.2027965
Show Author Affiliations
Jun Li, Nanjing Univ. of Aeronautics and Astronautics (China)
Lei Xia, Nanjing Univ. of Aeronautics and Astronautics (China)
Pengpeng Li, Nanjing Univ. of Aeronautics and Astronautics (China)
Yongwei Zhu, Nanjing Univ. of Aeronautics and Astronautics (China)
Yuli Sun, Nanjing Univ. of Aeronautics and Astronautics (China)
Dunwen Zuo, Nanjing Univ. of Aeronautics and Astronautics (China)


Published in SPIE Proceedings Vol. 8793:
Fourth International Conference on Smart Materials and Nanotechnology in Engineering
Jayantha A. Epaarachchi; Alan Kin-tak Lau; Jinsong Leng, Editor(s)

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