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Proceedings Paper

Advancements in automatic marking with range pattern matching
Author(s): D. Salazar; J. Valadez
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Paper Abstract

In previous work, an approach was detailed using CATS-MRCC-RPM, where new pattern matching functionality is used to find locations on a jobdeck that are suitable for mark placements and ultimately, metrology tool measurement locations. These locations are found by first creating pattern definitions. The defined patterns are passed to the CATS MRCC-RPM match algorithm which in turn outputs all found locations that match the description. In that previous work, the pattern definitions, also known as mark templates, had several limitations. For example, each template could hold only one mark placed at its center, and had to be symmetrical. This was considered to be severely limiting in nature and not production worthy for advanced mask manufacturing. This paper builds on top of the previous one in various ways, extends the possibilities, and provides mask makers unlimited options for extending metrology automation. Mark templates are expanded upon to hold multiple marks at different offsets from its center, and even of different types. Each template can be symmetrical or asymmetrical, and yet all the marks on it can still be correctly placed by taking advantage of match orientation information during the Classification step. Placement of other mark types beyond basic ones is also explored, such as Arbitrary Area. Lastly, the classification step is an enhancement process that thoroughly manages the use of chip/mark information. The result makes use of the output of JD MRC (jobdeck MRC) which executes RPM on jobdecks by chip in order to reduce redundant chips processing, rather than search all chip placements by extension.

Paper Details

Date Published: 28 June 2013
PDF: 10 pages
Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 87010O (28 June 2013); doi: 10.1117/12.2027338
Show Author Affiliations
D. Salazar, Synopsys, Inc. (United States)
J. Valadez, Synopsys, Inc. (United States)

Published in SPIE Proceedings Vol. 8701:
Photomask and Next-Generation Lithography Mask Technology XX
Kokoro Kato, Editor(s)

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