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Proceedings Paper

A new release device based on styrene-based SMP reinforced by carbon fiber
Author(s): Hanqing Wei; Chunyang Guan; Haiyang Du; Liwu Liu; Jinsong Leng
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Paper Abstract

Shape memory polymer composites (SMPC) release device can be fabricated to solve the disadvantages of traditional explosive release device, such as large weight, bad stability, and strong impact force and damage due to explosion. The release device is made up of two thin-walled tubes, the first one is responsible for the torsion, and the second is used to fit the first tube. The tubes are made from carbon fiber reinforced styrene-based shape memory polymer (SMP). Resistor heater is applied to heat the device and actuate the shape recovery process. This SMPC release device can connect the main device and the device which need released. When the instruction comes, it can separate the two devices immediately. Firstly, the first tube is heated by the resistor heater, then the twisting and stretching force is exited on the heating part of the tube, unloading after cooling, the two thin-walled tubes of release device is connected. Secondly, the twisted part of the first tube is heated, it twisted to the original angle, and then the stretched part drew back to the original shape after heating. So the working part pulled the claws of it out of the second tube automatically, and separated the release device to two parts, thus the release is completed. Optimal solutions are designed to achieve high driving efficiency. This paper has evaluated the strength and verified the feasibility of the SMPC release device, measured the tensile strength and the reverse effect, compared with the theoretical and experimental results. Finite element analysis is used to simulate the deformation.

Paper Details

Date Published: 9 August 2013
PDF: 10 pages
Proc. SPIE 8793, Fourth International Conference on Smart Materials and Nanotechnology in Engineering, 87930C (9 August 2013); doi: 10.1117/12.2027296
Show Author Affiliations
Hanqing Wei, Harbin Institute of Technology (China)
Chunyang Guan, Harbin Institute of Technology (China)
Haiyang Du, Harbin Institute of Technology (China)
Liwu Liu, Harbin Institute of Technology (China)
Jinsong Leng, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 8793:
Fourth International Conference on Smart Materials and Nanotechnology in Engineering
Jayantha A. Epaarachchi; Alan Kin-tak Lau; Jinsong Leng, Editor(s)

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