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Proceedings Paper

Ultra-low roughness magneto-rheological finishing for EUV mask substrates
Author(s): Paul Dumas; Richard Jenkins; Chuck McFee; Arun J. Kadaksham; Dave K. Balachandran; Ranganath Teki
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Paper Abstract

EUV mask substrates, made of titania-doped fused silica, ideally require sub-Angstrom surface roughness, sub-30 nm flatness, and no bumps/pits larger than 1 nm in height/depth. To achieve the above specifications, substrates must undergo iterative global and local polishing processes. Magnetorheological finishing (MRF) is a local polishing technique which can accurately and deterministically correct substrate figure, but typically results in a higher surface roughness than the current requirements for EUV substrates. We describe a new super-fine MRF® polishing fluid whichis able to meet both flatness and roughness specifications for EUV mask blanks. This eases the burden on the subsequent global polishing process by decreasing the polishing time, and hence the defectivity and extent of figure distortion.

Paper Details

Date Published: 23 September 2013
PDF: 8 pages
Proc. SPIE 8880, Photomask Technology 2013, 888005 (23 September 2013); doi: 10.1117/12.2026372
Show Author Affiliations
Paul Dumas, QED Technologies (United States)
Richard Jenkins, QED Technologies (United States)
Chuck McFee, QED Technologies (United States)
Arun J. Kadaksham, SEMATECH North (United States)
Dave K. Balachandran, SEMATECH North (United States)
Ranganath Teki, SEMATECH North (United States)

Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)

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