Share Email Print
cover

Proceedings Paper

Analysis of EUV mask durability under various absorber etch conditions
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

During EUV exposure, more frequent mask cleaning is essential for removing not only particles from lack of pellicle but also the carbon contamination due to accumulative EUV exposure. Because of this reason, process improvement for minimize corrosion and etching of the Ru capping layer is urgently needed. In this work, the influence of TaBN absorber etch condition on Ru integrity followed by repetitive cleaning was evaluated and the effects on long-term durability of Ru are compared under various cleaning conditions. Consequently, it was shown that Ru durability was strongly influenced by the gas contents and over etch time of absorber dry etch, not only as a function of cleaning conditions.

Paper Details

Date Published: 9 September 2013
PDF: 11 pages
Proc. SPIE 8880, Photomask Technology 2013, 88801Y (9 September 2013); doi: 10.1117/12.2026206
Show Author Affiliations
Dong Wook Lee, SK Hynix, Inc. (Korea, Republic of)
Sang Jin Jo, SK Hynix, Inc. (Korea, Republic of)
Sung Hyun Oh, SK Hynix, Inc. (Korea, Republic of)
Tae Joong Ha, SK Hynix, Inc. (Korea, Republic of)
Sang Pyo Kim, SK Hynix, Inc. (Korea, Republic of)
Dong Gyu Yim, SK Hynix, Inc. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)

© SPIE. Terms of Use
Back to Top