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Proceedings Paper

Development of CMOS-compatible membrane projection lithography
Author(s): D. Bruce Burckel; Sally Samora; Mike Wiwi; Joel R. Wendt
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Paper Abstract

Recently we have demonstrated membrane projection lithography (MPL) as a fabrication approach capable of creating 3D structures with sub-micron metallic inclusions for use in metamaterial and plasmonic applications using polymer material systems. While polymers provide several advantages in processing, they are soft and subject to stress-induced buckling. Furthermore, in next generation active photonic structures, integration of photonic components with CMOS electronics is desirable. While the MPL process flow is conceptually simple, it requires matrix, membrane and backfill materials with orthogonal processing deposition/removal chemistries. By transitioning the MPL process flow into an entirely inorganic material set based around silicon and standard CMOS-compatible materials, several elements of silicon microelectronics can be integrated into photonic devices at the unit-cell scale. This paper will present detailed fabrication and characterization data of these materials, emphasizing the processing trade space as well as optical characterization of the resulting structures.

Paper Details

Date Published: 11 September 2013
PDF: 7 pages
Proc. SPIE 8806, Metamaterials: Fundamentals and Applications VI, 880613 (11 September 2013); doi: 10.1117/12.2024591
Show Author Affiliations
D. Bruce Burckel, Sandia National Labs. (United States)
Sally Samora, Sandia National Labs. (United States)
Mike Wiwi, Sandia National Labs. (United States)
Joel R. Wendt, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 8806:
Metamaterials: Fundamentals and Applications VI
Allan D. Boardman; Nader Engheta; Mikhail A. Noginov; Nikolay I. Zheludev, Editor(s)

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