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Proceedings Paper

Stress analysis of encapsulated solar cells by means of superposition of thermal and mechanical stresses
Author(s): Sascha Dietrich; Matthias Pander; Martin Sander; Ulli Zeller; Matthias Ebert
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Paper Abstract

Within this contribution several 3D nite- element- models have been created in order to simulate processing of solar cells (lamination, soldering) as well as mechanical bending. The stress state for each load case was analysed with respect to magnitude and direction of principal stresses. For the process steps there are di erent mechanisms that induce stresses in the silicon. For soldering the mismatch in CTE is dominant. For lamination, bending around the ribbon is the dominant mechanism, which is due to the contraction of the encapsulant. Furthermore, it was found that cooling during lamination applies the highest loads into a solar cell. Mechanical bending was simulated and investigated experimentally by 4-point-bending with di erent load ramps. Due to strain-rate dependent properties of the encapsulant EVA there is a minor in uence on the load de ection behaviour but a large in uence on the reliability of a solar cell. By means of a parameter study the in uence of the cell distance on mechanical reliability was investigates. It was shown that a small cell distance (here < 3mm) increases the probability of failure of the solar cell signi cantly.

Paper Details

Date Published: 24 September 2013
PDF: 10 pages
Proc. SPIE 8825, Reliability of Photovoltaic Cells, Modules, Components, and Systems VI, 882505 (24 September 2013); doi: 10.1117/12.2024319
Show Author Affiliations
Sascha Dietrich, Fraunhofer-Ctr. für Silizium-Photovoltaik (Germany)
Matthias Pander, Fraunhofer-Ctr. für Silizium-Photovoltaik (Germany)
Martin Sander, Fraunhofer-Ctr. für Silizium-Photovoltaik (Germany)
Ulli Zeller, Fraunhofer-Ctr. für Silizium-Photovoltaik (Germany)
Matthias Ebert, Fraunhofer-Ctr. für Silizium-Photovoltaik (Germany)


Published in SPIE Proceedings Vol. 8825:
Reliability of Photovoltaic Cells, Modules, Components, and Systems VI
Neelkanth G. Dhere; John H. Wohlgemuth; Kevin W. Lynn, Editor(s)

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